Spin Processing Method And Apparatus
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United States of America Patent
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Issued Date -
Feb 5, 2009
app pub date -
Mar 30, 2005
filing date -
Mar 30, 2005
priority date (Note) -
Abandoned
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Abstract
There are provided a spin processing method and a spin processing apparatus with which the improvement of a processing speed in spin processing can be compatible with the saving of a processing solution. The spin processing method comprises holding and fixing the wafer on the upper surface of the spin table, and supplying the processing solution to the surface of the wafer by the predetermined amount while rotating the spin table, to process the surface of the wafer, wherein the processing solution is supplied while the wafer is heated and maintained at the predetermined temperature, to process the wafer. The predetermined temperature for heating the wafer is equal to or higher than 25° C.
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