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Abstract

A method for fabricating a rigid lamination. The method includes providing a first rigid substrate, disposing an adhesive on a surface of the first rigid substrate and disposing a second rigid substrate on at least a portion of the adhesive. The second rigid substrate has a first end and a second end. The second rigid substrate is heated to a substantially uniform temperature, where the temperature is sufficient to melt the adhesive. A non-uniform pressure is applied to a surface of the second rigid substrate. The non-uniform pressure includes a lesser pressure and a greater pressure, where the greater pressure is applied at the first end of the second rigid substrate and is sufficient to impart adhesive flow in a direction toward the second end. The pressure is controllably increased along at least a portion of the surface between the first end and the second end, where the increase is controlled to drive the adhesive flow in the direction toward the second end until the pressure applied is substantially uniform across the surface and the adhesive between the first rigid substrate and the second rigid substrate is substantially free of entrained gas bubbles. The adhesive is cooled to form a rigid lamination having adhesive substantially free of entrained gas bubbles.

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First Claim