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Abstract

The present invention provides a novel approach for selectively forming an electroless plated metal layer which enables selective formation of an electroless plated metal layer in an intended shape of the circuit pattern on a surface of a non-conductive substrate, without using a plating mask layer, in a form that a surface of an adhesive layer and the plated metal layer are in direct contact with each other. In the method, an adhesive layer of a curable binder resin is provided to a surface of a non-conductive substrate on which metal fine particles having an average particle size of 1 to 200 nm are closely exposed at a high area density, and an energy beam is irradiated to a region corresponding to the shape of a circuit pattern, and the non-conductive substrate is subjected to a deforming process and then to electroless plating, so that an electroless plated metal layer is selectively formed only to the energy beam irradiated region which is fixedly attached to the surface of the non-conductive substrate via the adhesive layer with a high adhesion.

First Claim