METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL
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United States of America Patent
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Issued Date -
Jan 29, 2009
app pub date -
Jun 5, 2008
filing date -
Jul 23, 2007
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Abandoned
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Abstract
A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.
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