Electronic Module Expansion Bridge
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jan 29, 2009
app pub date -
Sep 29, 2006
filing date -
Sep 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Taught herein is an electronic module expansion bridge (115). In an exemplary embodiment, the bridge (115) includes a flexible mounting plate (155). In contact with the mounting plate (155) is a conductive lead (160) with at least one first contact area (165) and at least one second contact area (170). The bridge (115) is configured to connect an electronic module (110), at the first contact area (165), to a conductive trace (125) that is in contact with a substrate (105) at the second contact area (170). In one embodiment, a substrate (105) is used to form a package (100) for enclosing one or more articles. An electronic module (110) is positioned in the package (100) and connected to the conductive trace (125) via the bridge (115). In an alternative embodiment, the bridge (115) is extended to form an inner sleeve to enclose or otherwise cover or protect the electronic module (110).
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