METHOD OF MAKING A WAFER HAVING AN ASYMMETRIC EDGE PROFILE
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United States of America Patent
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app pub date -
Sep 18, 2008
filing date -
Apr 20, 2006
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Abstract
A wafer having an asymmetric edge profile is provided. The wafer has a disk-like body. The disc-like body has a first main surface, a second main surface parallel to the first main surface, and an edge region. The disk-like body has a central line defined between the first main surface and the second main surface, the edge region has an edge profile, and the edge profile is asymmetric with respect to the central line of the first main surface and the second main surface.
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