METHOD AND APPARATUS FOR HMDS TREATMENT OF SUBSTRATE EDGES
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United States of America Patent
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Issued Date -
Jan 22, 2009
app pub date -
Jul 18, 2007
filing date -
Jul 18, 2007
priority date (Note) -
Abandoned
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Abstract
A system for dispensing an adhesion promoting chemical includes a support plate configured to support a substrate and a dispense nozzle in fluid communication with a source of the adhesion promoting chemical, for example, HMDS. The dispense nozzle is positioned adjacent a peripheral portion of the substrate and at a first radial distance. The system also includes an exhaust aperture in fluid communication with a system exhaust. The exhaust aperture is positioned adjacent to dispense nozzle and at a second radial distance greater than the first radial distance.
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