BONDING WIRE
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United States of America Patent
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Issued Date -
Jan 22, 2009
app pub date -
Feb 13, 2007
filing date -
Feb 13, 2006
priority date (Note) -
Abandoned
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Abstract
The invention relates to a gold alloy containing 99 wt. %, preferably 99.9 wt. % gold, and 1 to 1000 ppm, preferably 10 to 100 ppm calcium, and 1 to 1000 ppm, preferably 10 to 100 ppm ytterbium or europium or a mixture of ytterbium and europium, as well as a method for producing a homogeneous gold alloy containing europium and/or ytterbium.
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