HIGH TEMPERATURE PACKAGING FOR SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Jan 22, 2009
app pub date -
Jul 20, 2007
filing date -
Jul 20, 2007
priority date (Note) -
Abandoned
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Abstract
A method of forming multiple bonds on an electronic device includes heating first bonding metals at a predetermined temperature to form a first bond comprising a first melting temperature above the predetermined temperature. The first bond and second bonding metals are then heated at the predetermined temperature to form a second bond comprising a second melting temperature above the predetermined temperature.
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