WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 22, 2009
app pub date -
Jul 15, 2008
filing date -
Jul 19, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In order to prevent bonded wires from being damaged during another wire bonding in a semiconductor device, there is provided a wire bonding method for wire-connecting pads on a semiconductor chip and multiple leads corresponding to the pads in a semiconductor device to be manufactured by sealing the semiconductor chip and the leads together in one block, in which bumps and are formed with an ultrasonic vibration on all of the pads on the semiconductor chip and the leads included in the one block, and then wires are provided, with no ultrasonic vibration, for connection between the bumps and on the pads and the leads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully