PROBE ASSEMBLY AND METHOD FOR PRODUCING IT
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United States of America Patent
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Issued Date -
Jan 15, 2009
app pub date -
Jun 26, 2008
filing date -
Jul 11, 2007
priority date (Note) -
Abandoned
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Abstract
A method of producing a probe assembly which uses thermal energy of a laser light for bonding a plurality of connection pads provided on a probe board and a probe disposed on each connection pad. In the neighborhood of at least one of the connection pads on the probe board, a dummy connection pad with no probe adhered is formed in order to uniform the thermal energy by irradiation of each bonding portion of each connection pad and the corresponding probe.
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