Packaging for piezoelectric resonator
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Jan 15, 2009
app pub date -
Jul 13, 2007
filing date -
Jul 13, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention concerns a package comprising a case (10) for receiving a piezoelectric resonator (11), including a main part (12) with a bottom (13) and sides (14), in which the resonator shall be mounted and a cover (26) fixed to the main part closing the case, wherein the main part and the cover are both made of silicon.
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