SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

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United States of America Patent

APP PUB NO 20090014869A1
SERIAL NO

11718192

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Abstract

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A semiconductor device package, for example a flip-chip package, having a solder bump mounted above a polymer layer for use in flip-chip mounting of a semiconductor device to a circuit board. A polymer layer such as polybenzoxazole is formed overlying a wafer passivation layer. Solder bumps are attached to an under-bump metallization layer and electrically coupled to conductive bond pads exposed by openings in the wafer passivation layer.

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Patent Owner(s)

Patent OwnerAddress
FLIPCHIP INTERNATIONAL LLC3701 E UNIVERSITY DR PHOENIX AS 85034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Balkan, Haluk Phoenix , US 2 45
Curtis, Anthony Gilbert , US 7 108
King, Brian Gilbert , US 68 1787
Lu, Yuan Phoenix , US 82 691
Trimmer, Bret Mesa , US 3 43
Vrtis, Joan K Mesa , US 20 353

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