SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20090014126A1
SERIAL NO

12170406

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes a development part for performing a development process on a substrate after being subjected to exposure and a cleaning part. When the processing time in the development part is shorter than the reference time determined in advance, the development part performs all the process steps for development. On the other hand, when the processing time in the development part is longer than the reference time, the development process is split into a first half process step and a second half process step, and the development part performs a processing including the first half process step and the cleaning part performs a processing including the second half process step. Even if the development process takes a long time, it is possible to prevent deterioration in processing capability of the substrate processing apparatus on the whole by splitting the development process.

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Patent Owner(s)

Patent OwnerAddress
SOKUDO CO LTDKYOTO CITY KYOTO PREFECTURE JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koyama, Yasufumi Shimogyo-ku , JP 15 287
Ohtani, Masami Shimogyo-ku , JP 49 1552

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