METHOD OF REMOVAL PROFILE MODULATION IN CMP PADS
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United States of America Patent
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app pub date -
Jun 18, 2008
filing date -
Apr 6, 2007
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Abstract
A polishing pad includes a plurality of polishing surfaces, a first group of the polishing surfaces made of a first material having a first coefficient of friction and a second group of the polishing surfaces made of a second material having a second coefficient of friction. The first and second groups of polishing surfaces may be arranged over the polishing pad so as to provide a non-planar material removal profile. The polishing surface layout may be designed by evaluating a material removal profile for an existing polishing pad of known characteristics, observing how variations in polishing surface densities and/or coefficients of friction affect that material removal profile, and then mapping the polishing surface coefficients of friction and density profiles to the subject polishing pad layout.
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