Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method
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United States of America Patent
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Oct 11, 2011
Grant Date -
Jan 8, 2009
app pub date -
Jun 24, 2008
filing date -
Apr 13, 2007
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Abstract
A pattern forming method includes (a) coating a substrate with a resist composition including a resin that includes a repeating unit represented by a following general formula (NGH-1), and, by the action of an acid, increases the polarity and decreases the solubility in a negative developing solution; (b) exposing; and (d) developing with a negative developing solution:represents a hydroxyl group.
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