METHOD FOR TREATING SURFACE OF HEAT DISSIPATING MODULE

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United States of America Patent

APP PUB NO 20090011131A1
SERIAL NO

12146475

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Abstract

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A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted.

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Patent Owner(s)

Patent OwnerAddress
AMA PRECISION INC3F NO 37 SEC 2 JHONGYANG S RD PEITOU DISTRICT TAIPEI 112

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Hsueh-Lung Taipei , TW 8 8
Chou, Yu-Cheng Taipei, TW 17 62
Shen, Chich-Hua Taipei, TW 4 15
Tsai, Ming-Feng Taipei , TW 35 83
Tsai, Te-Li Taipei, TW 1 0

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