Metallic Ink, and Method for Forming of Electrode Using the Same and Substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
May 9, 2008
filing date -
Nov 9, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed is a metallic ink, a method of forming electrodes using the metallic ink, and a substrate using the metallic ink. The metallic ink comprises at least one oxide selected from metal oxide nanoparticles and partially polycondensated metal oxides having a size of 100 nm or less, and metal nanoparticles having a size of 100 nm or less. The oxides and the metal nanoparticles are dispersed as isolated ultrafine particles in solvent. The method comprises patterning the ink using an inkjet printer to form a conductive wire. The substrate is produced through the method. It is thereby possible to conduct patterning using an inkjet printer, and adhesive power to substrates is improved. The metallic ink is useful to produce electrodes of various panels, such as PDPs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully