Evaporative cooling system for electronic components
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United States of America Patent
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Issued Date -
Jan 1, 2009
app pub date -
Apr 11, 2008
filing date -
Apr 13, 2007
priority date (Note) -
Abandoned
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Abstract
An apparatus for cooling a number of electronic components comprises an enclosure within which the components are positioned, an arrangement for circulating a cooling fluid to the components so that the cooling fluid can evaporate on or proximate the components and thereby absorb the heat generated by the components, a mechanism for condensing the evaporated cooling fluid, and a reservoir which is in fluid communication with the circulating means and within which the condensed cooling fluid collects.
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