Thermosetting Polyamide Foam, Uses Thereof, and Method for Producing Thermosetting Polyamide
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United States of America Patent
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Issued Date -
Dec 25, 2008
app pub date -
Jan 6, 2005
filing date -
Jan 6, 2004
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Abstract
A thermosetting polyamide foam prepared by reacting a polyisocyanate compound with a polyester polycarboxylic acid using a compound having a P.dbd.N bond as a catalyst under conditions of an NCO index of not less than 1.6. The polyamide foam is excellent in heat resistance (thermal decomposition resistance) and moldability, and is applicable for heat-resistant vibration dampers, heat-resistant sound-absorbing materials and heat-resistant cushioning materials.
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