CHEMICAL MECHANICAL PLANARIZATION PAD AND METHOD OF USE THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jan 2, 2008
filing date -
Nov 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A web-style polishing pad includes a guide layer through which individual polishing elements protrude on one side and a flexible under-layer attached to the other side. The polishing elements may be affixed at their base to the compressible under-layer and pass through corresponding holes in the guide layer so as to be maintained and translatable in a substantially orthogonal orientation with respect to a plane defined by the guide layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully