TWO STEP CHEMICAL MECHANICAL POLISH
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 25, 2008
app pub date -
Jun 22, 2007
filing date -
Jun 22, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In one embodiment, a method includes providing two structures with a spacing therebetween over a semiconductor substrate, providing a conformal first layer over the two structures and within the space therebetween, depositing a conformal protective layer over the first layer, planarizing the protective layer until a top surface of the first layer is exposed, and planarizing the first layer and the protective layer until a top surface of the two structures is exposed and a portion of the protective layer is between the two structures.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully