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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
INNOVATIVE MICRO TECHNOLOGY	75 ROBIN HILL ROAD GOLETA CA 93117

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Erlach, David M	Santa Barbara, CA	12	102
# of filed Patents : 12 Total Citations : 102
Summers, Jeffery F	Santa Barbara, CA	29	263
# of filed Patents : 29 Total Citations : 263
Thompson, Douglas L	Santa Barbara, CA	14	121
# of filed Patents : 14 Total Citations : 121

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Patent Citation Ranking

• 1 Citation Count
• H01L Class

• 1.99 % this patent is cited more than
• 17 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2008/0318,349

Wafer level hermetic bond using metal alloy

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Abstract

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Systems and methods for forming an encapsulated MEMS device include a hermetic seal which seals an insulating gas between two substrates, one of which supports the MEMS device. The hermetic seal may be formed by heating at least two metal materials, in order to melt at least one of the metal materials. The first melted metal material flows into and forms an alloy with a second metal material, forming a hermetic seal which encapsulates the MEMS device.

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Description

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