Thermal Release
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United States of America Patent
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Issued Date -
Dec 25, 2008
app pub date -
Oct 6, 2005
filing date -
Nov 10, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a thermal tripping device which is heated indirectly by means of a heating winding and which comprises a release strip made of thermostatic bimetal, a form memory alloy or similar. An insulating intermediate layer is arranged between the heating winding and the release strip and one of the ends of the heating winding is connected to a supply conductor. The heating winding is embodied in an identically meandering manner for all current intensities and is folded about the insulating intermediate layer. In order to modify the resistance of the heating winding for other current intensities, the discharge is connected to a wiring point between the ends of the heating windings.
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