Chemical-Mechanical Polishing Compositions Containing Aspartame And Methods Of Making And Using The Same
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United States of America Patent
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Issued Date -
Dec 25, 2008
app pub date -
Apr 17, 2008
filing date -
Jun 19, 2007
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Abstract
The present invention provides an aqueous CMP slurry composition that comprises abrasive particles and Aspartame. The CMP slurry composition according to the invention is selective for polishing silicon dioxide in preference to silicon nitride from a surface of an article by chemical mechanical planarization. Furthermore, as more Aspartame is added to the slurry, the silicon dioxide rate is either not greatly affected or increases and the silicon nitride rate stays extremely low. In addition to offering selectivity of silicon dioxide to silicon nitride polishing, the present invention provides a method of using Aspartame as a polish accelerant in silicon dioxide polishing.
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