Reactive Multilayer Joining To Control Thermal Stress
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United States of America Patent
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Issued Date -
Dec 25, 2008
app pub date -
Jun 20, 2008
filing date -
Jun 22, 2007
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Abandoned
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Abstract
A method for bonding components with a reactive multilayer foil, wherein during bonding, the components are held at a temperature or temperature gradient chosen to reduce thermal stress in the resulting bonded product.
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