Method of Forming Semiconductor Layers on Handle Substrates
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United States of America Patent
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Issued Date -
Dec 18, 2008
app pub date -
Aug 2, 2006
filing date -
Aug 3, 2005
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Abandoned
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Abstract
A method of making a semiconductor thin film bonded to a handle substrate includes implanting a semiconductor substrate with a light ion species while cooling the semiconductor substrate, bonding the implanted semiconductor substrate to the handle substrate to form a bonded structure, and annealing the bonded structure, such that the semiconductor thin film is transferred from the semiconductor substrate to the handle substrate.
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