Fluorine Resin Laminated Substrate
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United States of America Patent
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Issued Date -
Dec 18, 2008
app pub date -
Dec 5, 2006
filing date -
Dec 5, 2005
priority date (Note) -
Abandoned
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Abstract
A fluorine resin laminated substrate according to the present invention is a fluorine resin laminated substrate provided with multiple substrates on which circuit patterns are formed, and adhesive layers that adhere the multiple substrates together; wherein, the substrates are composed of a prepreg formed by impregnating a reinforcing fiber sheet with a first fluorine resin mixture, the adhesive layers are composed of a film of a second fluorine resin mixture, and the second fluorine resin mixture is a heat-meltable fluorine resin mixture having a melting point lower than the first fluorine resin mixture.
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