HOT EMBOSSING OF STRUCTURES
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United States of America Patent
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Issued Date -
Dec 18, 2008
app pub date -
Jun 10, 2008
filing date -
Jun 14, 2007
priority date (Note) -
Abandoned
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Abstract
There is described a process for the production of structures on substrates. At least one transfer layer (22) is transferred completely or region-wise on to the surface of the substrate (1) by an embossing film (2), in particular a hot embossing film, wherein the transfer layer (22) has regions which are formed by a binding agent. Open pores are produced in the transfer layer transferred on to the substrate (1), by the binding agent being expelled. A filler can then be introduced into the open pores. There is also described an embossing film for producing structures on a substrate.
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