Method and a Device in Die-Cutting, and a Die-Cutting Press
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United States of America Patent
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Issued Date -
Dec 11, 2008
app pub date -
Jan 17, 2006
filing date -
Jan 17, 2005
priority date (Note) -
Abandoned
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Abstract
A method and a device for producing a diffractive microstructured area on the surface layer of a substrate by embossing. The device includes a die-cutting press that includes a press member and a backing member and at least one die-cutting tool arranged for die-cutting the substrate placed between the press member and the backing member. The press member and/or the backing member is provided with at least embossing pattern corresponding to the microstructured area, against which pattern the substrate is pressed during the embossing, when the substrate is introduced between the press member and the backing member for the embossing. A method for converting a die-cutting press to a die-cutting and embossing device for producing a diffractive microstructured area on the surface layer of a substrate by embossing, wherein the press member and/or the backing member of the die-cutting press is provided with at least one embossing pattern corresponding to the microstructured area for embossing.
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