Microstructure Inspecting Apparatus and Microstructure Inspecting Method
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United States of America Patent
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Issued Date -
Dec 11, 2008
app pub date -
Sep 9, 2005
filing date -
Sep 13, 2004
priority date (Note) -
Abandoned
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Abstract
Voltage is applied to a chip TP by a voltage drive unit 30 through a probe needle P to move a movable part of a microstructure. A sound produced in response to motion of the movable part of the microstructure is detected by a microphone 3. Then, the sound detected by the microphone 3 is measured by a measurement unit 25. The control unit 20 evaluates the characteristics of the tested chip TP by comparing with a sound detected from an ideal chip TP.
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