Bonded Plate for Sink Bowl and Method of Forming the Sink Bowl Using the Same Through Pressing
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United States of America Patent
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Issued Date -
Dec 4, 2008
app pub date -
May 30, 2008
filing date -
May 31, 2007
priority date (Note) -
Abandoned
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Abstract
A bonded plate for a sink bowl, which has excellent sound-absorbing, vibration-damping, and heat-insulating characteristics, and a method of forming the sink bowl using the same through pressing. The bonded plate includes a surface plate, a backing plate backing the surface plate, and an adhesive resin interposed between the surface plate and the backing plate and bonding the surface plate and the backing plate with each other, wherein the adhesive resin has a thickness from about 0.02 mm to about 0.1 mm. Thereby, the adhesive resin layer of the bonded plate can have sound-absorbing, vibration-damping, and dew-condensation-preventing functions. Further, the sink bowl is produced using the bonded plate, so that it can reduce the cost of production, can provide formability equal to that of the conventional sink bowl, and can produce excellent sound-absorbing, vibration-damping, and dew-condensation-preventing effects.
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