Low Adhesion Material, Resin Molding Die, and Soil Resistant Material
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United States of America Patent
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Issued Date -
Dec 4, 2008
app pub date -
Dec 27, 2006
filing date -
Jan 26, 2006
priority date (Note) -
Abandoned
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Abstract
A resin molding die has a molding surface formed of a low adhesion material formed of a solid solution of La--Y.sub.2O.sub.3 produced from Y.sub.2O.sub.3 and an other oxide of La.sub.2O.sub.3. La.sub.2O.sub.3 contains La, which has an ionic radius larger than Y.sup.3+, and is larger in basicity than Y.sub.2O.sub.3. The low adhesion material contains La.sub.2O.sub.3 at a predetermined ratio relative to a total of Y.sub.2O.sub.3 and La.sub.2O.sub.3. The low adhesion material thus has a large iconic radius contributing to a smaller number of sites per unit area than Y.sub.2O.sub.3, a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y.sub.2O.sub.3, and a ratio contributing to shape retention. The low adhesion material thus less adhesive and more shape-retentive than Y.sub.2O.sub.3 configures the molding surface. A low adhesion material that is less adhesive to a basic substance than Y.sub.2O.sub.3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained.
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