COAT/DEVELOP MODULE WITH SHARED DISPENSE
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United States of America Patent
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app pub date -
Jun 9, 2008
filing date -
Dec 22, 2004
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Abandoned
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Abstract
An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
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