System and method for installing a semiconductor manufacturing apparatus
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United States of America Patent
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N/A
Issued Date -
Dec 4, 2008
app pub date -
May 30, 2007
filing date -
May 30, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and a method for installing a semiconductor manufacturing apparatus comprising several modules, each of which is provided with a number of module supporting feet at a bottom side. The system and the method comprise a supporting point reduction frame, having an upper side and a bottom side, said frame at the upper side being provided with a number of first supporting points, such that each foot of a module of said semiconductor manufacturing apparatus corresponds with a first supporting point, said supporting point reduction frame at the bottom side being provided with a number of second supporting points, whereby the total number of module supporting feet exceeds said number of second supporting points, and the stiffness of said supporting point reduction frame being such that, during transportation, deviations in the relative positions of the modules mounted on said supporting point reduction frame remain within specified transportation limits.
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