Method and Device for Continuously Producing Electronic Film Components and an Electronic Film Component
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United States of America Patent
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Issued Date -
Dec 4, 2008
app pub date -
Feb 1, 2005
filing date -
Feb 4, 2004
priority date (Note) -
Abandoned
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Abstract
The invention relates to a method and device for continuously producing electronic film components, during which chip modules (5) are, via their electrical connecting contacts (3), placed on antenna connections (2) of antenna film sections. The invention provides that: the chip modules (5), via their rear side facing away from the connecting contacts (3), are placed on adhesive film sections (7, 8) whose base area is significantly larger than a base area of each chip module; the electric connecting contacts of the chip modules are electrically contacted by antenna connections, and; the adhesive film sections (7, 8) are flatly joined to the antenna film sections in such a manner that the chip modules are fixed in their position relative to the antenna connections. The invention is for use in flexible transponder labels.
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