MANUFACTURING METHOD OF METAL STRUCTURE IN MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF
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United States of America Patent
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Issued Date -
Nov 27, 2008
app pub date -
Dec 5, 2007
filing date -
May 25, 2007
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Abandoned
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Abstract
Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.
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