Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same
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United States of America Patent
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Issued Date -
Nov 27, 2008
app pub date -
May 21, 2007
filing date -
May 21, 2007
priority date (Note) -
Abandoned
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ backside substrate release and/or seal or encapsulation techniques.
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