LIGHT EMITTING DIODE PACKAGE
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United States of America Patent
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N/A
Issued Date -
Nov 27, 2008
app pub date -
Mar 27, 2008
filing date -
May 23, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A light emitting diode (LED) package including a heat dissipation base, an electrical insulating layer, a circuit layer, and an LED chip is provided. The electrical insulating layer is disposed on the heat dissipation base. The circuit layer is disposed on the electrical insulating layer. The circuit layer has a receiving hole extending and passing through the electrical insulating layer for exposing a portion of the heat dissipation base. The LED chip is disposed on the heat dissipation base exposed by the receiving hole and is electrically connected to the circuit layer.
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