POLISHING PAD, USE THEREOF AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Nov 20, 2008
app pub date -
May 18, 2007
filing date -
May 18, 2007
priority date (Note) -
Abandoned
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Abstract
The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
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