LOW PRESSURE DOUGH PACKAGING
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United States of America Patent
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N/A
Issued Date -
Nov 20, 2008
app pub date -
May 12, 2008
filing date -
May 11, 2007
priority date (Note) -
Abandoned
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Abstract
Described are dough packages that include one or more of a container and an opening, optionally including an open end and an endcap, wherein the package may be vented or non-vented, and may contain dough for storage at refrigerated conditions.
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