BUMP STRUCTURE
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United States of America Patent
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Issued Date -
N/A
app pub date -
Aug 7, 2007
filing date -
May 18, 2007
priority date (Note) -
Abandoned
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Abstract
A bump structure including at least one contact pad, at least one first polymer bump, at least one second polymer bump, and a conductive layer is provided. The contact pad is disposed on a substrate, and the first polymer bump is also disposed on the substrate. The second polymer bump is disposed on the substrate and is connected to the first polymer bump. The conductive layer covers the first polymer bump and electrically connects the contact pad.
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