METHOD AND APPARATUS FOR BONDING OPTICAL DISC SUBSTRATES TOGETHER, AND METHOD FOR SUPPLYING LIQUID MATERIAL

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

11856199

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ORIGIN ELECTRIC COMPANY LIMITED18-1 TAKADA 1-CHOME TOSHIMA-KU TOKYO 171-8555

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaji, Kanya Tokyo, JP 4 9
Kobayashi, Hideo Tokyo, JP 434 4833
Nakamura, Masahiro Tokyo, JP 238 2644
Shinohara, Shinichi Tokyo, JP 21 144

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation