METHOD OF REMOVING MEMS DEVICES FROM A HANDLE SUBSTRATE
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United States of America Patent
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Issued Date -
Nov 20, 2008
app pub date -
May 6, 2008
filing date -
May 20, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of removing MEMS devices (2) from a handle substrate (1), where the MEMS devices are individually bonded to it via a thermal release adhesive (3) that reduces its adhesion when heated above a threshold temperature. The method heats the MEMS devices (2) individually with a heat source (10) to conductively heat the thermal release adhesive (11) above the threshold temperature. With the adhesive (11) directly in contact with the back side (5) of the MEMS device (2) no longer bonding it to the glass handle (1), the devices (2) can be individually removed by a die picker (6). This method quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, heating the die by conduction, will in turn conductively heat the adhesives that only that adhesive which is closely localized to the die is released. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.
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