HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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N/A
Issued Date -
Nov 13, 2008
app pub date -
Mar 25, 2008
filing date -
May 7, 2007
priority date (Note) -
Abandoned
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Abstract
A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The PCB is disposed on the surface of the substrate, such that the positioning part is located in the positioning hole. The LED chip is disposed on the positioning part and electrically connected to the PCB.
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