ELECTRICAL CONTACT DEVICE AND ITS MANUFACTURING PROCESS

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United States of America Patent

APP PUB NO 20080278185A1
SERIAL NO

11964369

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Abstract

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A method of making an electrical contact device includes the step of (a) preparing a substrate, (b) forming a dielectric layer on a surface of the substrate and forming a well on the dielectric layer by means of a non-etching technique, (c) forming a first sacrifice layer in the well, (d) forming a second sacrifice layer on the dielectric layer and the first sacrifice layer and defining a probe body contour and forming a probe body metal layer in the probe body contour and then repeating this step once or several times to form a probe structure, and (e) removing the sacrifice layers to obtain the desired electrical contact device having the substrate and the probe structure.

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Patent Owner(s)

Patent OwnerAddress
MJC PROBE INCORPORATIONNO 155 CHUNG-HO ST CHU-PEI CITY HSINCHU HSIANG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chih-Chung Chu-Pei City, TW 124 1645

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