Method for Producing a Microcircuit Card
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United States of America Patent
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Issued Date -
Nov 6, 2008
app pub date -
Dec 22, 2006
filing date -
Dec 26, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a method for producing a microcircuit card, comprising the following steps: a step for positioning a microcircuit in an open-cavity mould, and a step for depositing a material in the open cavity of the mould, the material being sufficiently poorly viscous for coating at least indirectly at least part of the microcircuit.
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