Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package

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United States of America Patent

SERIAL NO

10568075

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Abstract

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Cap for airtight sealing (1) that not only suppresses any deterioration of the properties of electronic parts (20) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer (2); Ni--Co alloy layer (3) superimposed on the surface of the low thermal expansion layer and composed mainly of Ni wherein a diffusion acceleration material is contained; Ni layer (4) superimposed on the surface of the Ni--Co alloy layer; and solder layer (5) superimposed on the surface of the Ni layer at regions for bonding of electronic part accommodation member (10) and composed mainly of Sn. The Ni layer has the functions of not only suppressing any diffusion of the Ni--Co alloy layer into the solder layer at about 235.degree. C. (first temperature) but also at bonding of the solder layer with the electronic part accommodation member at about 300.degree. to about 320.degree. C. (second temperature), diffusing the Ni--Co alloy layer via the Ni layer into the solder layer.

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Patent Owner(s)

Patent OwnerAddress
NEOMAX MATERIALS CO LTD2-19-1 MINAMI-SUITA SUITA-SHI OSAKA 564-0043

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hira, Junji Kagoshima, JP 2 22
Takano, Kenji Kagoshima, JP 68 446
Yamamoto, Masaharu Kagoshima, JP 32 319

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