Adhesive tape adhering device for wafers and method of adhering adhesive tape on wafers
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United States of America Patent
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N/A
Issued Date -
Nov 6, 2008
app pub date -
May 2, 2007
filing date -
May 2, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An adhesive tape adhering device includes a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit movably disposes on the table unit upwardly and downwardly for bearing a wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit disposes on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit disposes on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape. The rolling unit slidably disposes on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the adhesive tape on the at least one wafer
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