Automated Sputtering Target Production
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United States of America Patent
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N/A
Issued Date -
Nov 6, 2008
app pub date -
Jan 18, 2006
filing date -
Jan 19, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and method are provided for manufacturing a sputtering target. The system is preferably automated. Sub systems of the manufacturing system include a robotic part handling sub system, a weighing sub system adapted to measure the weight of a part to be manufactured into a sputtering target, and a machining sub system adapted to finish machine a part to be manufactured into a sputtering target. The system can further include a cleaning sub system adapted to clean a part to be manufactured into a sputtering target, an inspection sub system adapted to measure dimensions of a part to be manufactured into a sputtering target, and a feedback control sub system adapted to provide control signals to one or more of the robotic handling sub system, the weighing sub system, the cleaning sub system, and the inspection sub system to control processing performed by one or more of the sub systems.
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